Single Crystal Silicon Wafer N-type (4-inch)
Product Name: Single Crystal Silicon Wafer N-type (4-inch)
Product Name |
Single Crystal Silicon Wafer N-type (4-inch) |
Cat No. |
NCZ-NSC331/20 |
Día |
4 inches |
Type |
N |
Diameter (mm) |
4” (100.8mm) |
Type |
N-Type |
Doping |
Phosphorous |
Crystal Orientation |
<100> |
Surface: |
Single Side Polished |
Thickness |
250-500μm |
Resistivity |
1-10ohm-cm |
Crystal method |
CZ |
RRG (%) |
≤12 |
Oxygen Contents (ppm) |
12.5-16.5 |
Carbon Contents (ppm) |
≤1 |
Description:
Silicon (Si) and Silicon on insulator (SOI) wafer resizing. Our resizing process can also be applied to other wafer materials such as glass or GaAs.
Wafer resizing is sometimes referred to as wafer coring, re-sizing, cut down, cut-down, downsizing, down-sizing, size reducing or size reduction. We can accept orders ranging from a single wafer to hundreds of wafers per month. Our process is efficient, innovative, and ESD friendly. Our proprietary process causes less stress to the silicon wafer than other resizing methods. We also round wafer edges to eliminate edge chipping.
We frequently work with 2” (50 mm), 3” (75 mm), 100 mm (4”), 125 mm (5”), 150 mm (6”), 200 mm (8”), and 300 mm wafers; however, we are also capable of producing custom non-standard sizes.
Please email us for the customization.
Email: contact@nanochemazone.com
Please contact us for customization and price inquiry
Note: We supply different size ranges of Nano and micron as per the client’s requirements and also accept customization in the various parameters.