Product Name |
|
Product Code |
NCZ-VA-134/21 |
CAS No |
12159-07-8 |
Molecular Formula |
Cu5Si |
Particle Size |
D50=5μm |
Molar mass |
345.8155 g/mol |
Purity |
99.99% |
Melting Point |
825℃ |
Density |
7.8 g/cm3 |
Applications |
Thermoelectric conversion material |
Copper Silicide Description:
Copper silicide also called pent copper silicide, is a binary compound of silicon with copper. It is an intermetallic compound, meaning that it has properties intermediate between an ionic compound and an alloy. This solid crystalline material is a silvery solid that is insoluble in water. It forms upon heating mixtures of copper and silicon. Copper silicide thin film is used for passivation of copper interconnects, where it serves to suppress diffusion and electro migration and serves as a diffusion barrier.
Copper silicides are invoked in the direct process, the industrial route to organ silicon compounds. In this process, copper, in the form of its silicide, catalyses the addition of methyl chloride to silicon. An illustrative reaction affords the industrially useful dimethyldichlorosilane.
Related Information
Storage Conditions:
Airtight sealed, avoid light, and keep dry at room temperature.
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