₹0.00
| Product Name |
Copper Silicide Powder |
| Product Code | NCZ-VA-134/21 |
| CAS No | 12159-07-8 |
| Molecular Formula | Cu5Si |
| Particle Size | D50=5μm |
| Molar mass | 345.8155 g/mol |
| Purity | 99.99% |
| Melting Point | 825℃ |
| Density | 7.8 g/cm3 |
| Applications | Thermoelectric conversion material |
Copper silicide also called pent copper silicide, is a binary compound of silicon with copper. It is an intermetallic compound, meaning that it has properties intermediate between an ionic compound and an alloy. This solid crystalline material is a silvery solid that is insoluble in water. It forms upon heating mixtures of copper and silicon. Copper silicide thin film is used for passivation of copper interconnects, where it serves to suppress diffusion and electro migration and serves as a diffusion barrier.
Copper silicides are invoked in the direct process, the industrial route to organ silicon compounds. In this process, copper, in the form of its silicide, catalyses the addition of methyl chloride to silicon. An illustrative reaction affords the industrially useful dimethyldichlorosilane.
Storage Conditions:
Airtight sealed, avoid light, and keep dry at room temperature.
Please contact us for customization and price inquiry
Email: contact@nanochemazone.com
Note: We supply different size ranges of Nano and micron as per the client’s requirements and also accept customization in various parameters.
Note: For pricing & ordering information, please contact us at info@chemazone.in
Please contact us for quotes on Larger Quantities & Customization. E-mail: contact@nanochemazone.com
If you are planning to order large quantities for your industrial and academic needs, please note that customization of parameters (such as size, length, purity, functionalities, etc.) are available upon request.
[/vc_column_text][/vc_column][/vc_row]
